Dry SolderSponge – The New Standard
Since tip temperature is not reduced between operations with dry SolderSponge, the high operating temperatures can be reduced slightly with lead free solders. This reduces tip oxidation and reduces the risk of component damage with excessive heat.
The mild abrasive quality of SolderSponge cleans the tip directly in proportion to the number of wipes. It is possible to wipe the tip 'too clean' down to the iron coating. However with practice, with only two to three wipes, a film of solder remains on the tip to produce an easily wettable tip for the next soldering process. This is particularly important for the high temperature lead-free solders used to meet the new European RoHS Directive requirements as these solders have produced higher defect rates with wet sponges that fail to remove tip oxidation.
The fluctuations in temperature at each cycle with wet sponges demand a rapid feedback temperature control system and therefore increased cost of soldering iron station control systems. Dry SolderSponge produces no such demands on the soldering equipment.
Wet sponges use the local water supply – after several days there is a build up of calcium and other salts on the tip and on the sponge that can impair the quality of solder joints. SolderSponge does not build up salts and causes spent, contaminated solder to drop into the hole in the sponge for collection at the base of the sponge holder.
Every type of wet sponge on every soldering iron station or stand-alone sponge holder ever produced can be directly replaced with SolderSponge. There is no requirement for brass shavings or cleaning pastes or abrasive cleaners between operations.
The mild abrasive quality of SolderSponge cleans the tip directly in proportion to the number of wipes. It is possible to wipe the tip 'too clean' down to the iron coating. However with practice, with only two to three wipes, a film of solder remains on the tip to produce an easily wettable tip for the next soldering process. This is particularly important for the high temperature lead-free solders used to meet the new European RoHS Directive requirements as these solders have produced higher defect rates with wet sponges that fail to remove tip oxidation.
The fluctuations in temperature at each cycle with wet sponges demand a rapid feedback temperature control system and therefore increased cost of soldering iron station control systems. Dry SolderSponge produces no such demands on the soldering equipment.
Wet sponges use the local water supply – after several days there is a build up of calcium and other salts on the tip and on the sponge that can impair the quality of solder joints. SolderSponge does not build up salts and causes spent, contaminated solder to drop into the hole in the sponge for collection at the base of the sponge holder.
Every type of wet sponge on every soldering iron station or stand-alone sponge holder ever produced can be directly replaced with SolderSponge. There is no requirement for brass shavings or cleaning pastes or abrasive cleaners between operations.
In action
SolderSponge can replace all wet sponges on all old and new soldering iron stations and purpose-built sponge holders – without the need for water.
The panel below shows SolderSponge before and after some work. Note beads of solder collect and slide down slope of conical shaped hole. Most of the black deposit is fine solder deposit and flux residues. See “Burn Test” slide later.