Dry SolderSponge
No water required
- Constant tip temperature - faster and consistent operations
- Much cleaner tips
- No pitting - enhanced tip life
- Directly replaces cellulose sponges - nothing else required
Traditional Method
Wet cellulose sponge – the disadvantages
Wet cellulose sponge – the disadvantages
Lead / Tin Solder
- wiping process causes the water to cool the soldering iron tip
- cooled tip causes solidification leaving a residual amount of solder
- molten solder “rides” on wet sponge, remains instead on soldering tip
- rapid cooling stresses soldering iron tip thereby reducing life
- acid residues remain within wet sponge eroding tip on each wipe
RoHS Directive Lead Free Solder – as above but in addition
- the high temperature requirement for lead-free solder is compromised as each wiping action with a wet sponge cools the iron tip
- gradual build-up of oxidation due to reactive tin leaves tip difficult to wet with solder and eventually damages tip beyond use
- intermittently cooled tip increases build-up of black flux residues which also reduce ability for molten solder to wet the tip of soldering iron
- repeated wiping leaves tip un-tinned which is quickly oxidized and becomes unusable
The New Method
Dry SolderSponge – all the advantages
Dry SolderSponge – all the advantages
Lead / Tin Solder
- wiping process does not cool the soldering iron tip
- gentle abrasive property gives superior cleaning of residual solder
- molten solder readily forms globules on the sponge that fall away
- no stresses to soldering iron from cold shock – prolongs tip life
- no wet acid residues remain on dry sponge so tips are not eroded
RoHS Directive Lead Free Solder – as above but in addition
- high temperature requirement for lead-free solder is met as tip maintains temperature before next operation
- iron temperature can actually be reduced slightly to decrease risk of electronic component damage
- gentle but highly efficient abrasive property of melamine sponge wipes off build-up of oxides and thereby maintains tip wettability
- Continuously maintained high tip temperature eliminates build-up of black flux residues as they get wiped whilst still molten by the gentle abrasive action of melamine sponge
- only a single or double wipe required to maintain a film of solder on tip for efficient soldering
- wiping process does not cool the soldering iron tip
- gentle abrasive property gives superior cleaning of residual solder
- molten solder readily forms globules on the sponge that fall away
- no stresses to soldering iron from cold shock – prolongs tip life
- no wet acid residues remain on dry sponge so tips are not eroded
RoHS Directive Lead Free Solder – as above but in addition
- high temperature requirement for lead-free solder is met as tip maintains temperature before next operation
- iron temperature can actually be reduced slightly to decrease risk of electronic component damage
- gentle but highly efficient abrasive property of melamine sponge wipes off build-up of oxides and thereby maintains tip wettability
- Continuously maintained high tip temperature eliminates build-up of black flux residues as they get wiped whilst still molten by the gentle abrasive action of melamine sponge
- only a single or double wipe required to maintain a film of solder on tip for efficient soldering